Paper

Integrated microchannel cooling for three-dimensional circuit architectures

Koo, S. Im, L. Jiang, and K. Goodson, "Integrated microchannel cooling for three-dimensional circuit architectures," ASME Journal of Heat Transfer, vol. 127, 2005, pp. 49--58.

2005

Created by ACM worker at 2019-04-14 13:08:38.0.
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