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Memory Technology for Extended Large-scale Integration in Future Electronics Applications



2008

Created by Alysson Bolognesi Prado at 2017-03-16 11:24:43.0.
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2

ACM - affordances

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1

Dinesh Pamunuwa

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7

performance, cost and technological tradeoffs, Proceedings of the 2007 IEEE/ACM international conference on Computer-aided design, November 05-08, 2007, San Jose, California

How to solve the current memory access and data transfer bottlenecks

Performance comparison of interconnect technology and architecture options for deep submicron technology nodes

A 56-nm CMOS 99-mm2 8-Gb Multi-Level NAND Flash Memory With 10-MB/s Program Throughput

A novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration," Proceedings of the IEEE, vol

Integrated microchannel cooling for three-dimensional circuit architectures

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Memory Technology for Extended Large-scale Integration in Future Electronics Applications


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